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Fiber laser cutting machine 2000W tutorial processing typesetting matters for attention

Views:3     Author:DURMAPRESS     Publish Time: 2021-08-30      Origin:DURMAPRESS Inquire

Fiber laser cutting machine 2000W tutorial processing typesetting matters for attention

Fiber laser cutting machine 2000W has been widely used in many metal processing industries. One of the advantages of laser machining is that various graphics can be designed to achieve flexible machining of complex parts. At the same time, reasonable typesetting software can greatly improve the cutting efficiency and quality, reduce the consumption of raw materials. So, what are the key points to pay attention to when typesetting?

Corner handle

Cutting Angle, the feed speed will be reduced, long time Fiber laser cutting machine material will melt, resulting in product quality decline, and at the corner will produce a small radius, so you can maintain high-speed cutting, so as to obtain good cutting quality, reduce cutting time, improve productivity.

Master part spacing

When cutting thin plate, the spacing between parts can be appropriately reduced, but when cutting thick metal plate, typesetting should pay attention to leave enough clearance, otherwise it is easy to lead to adjacent parts affected by heat, or cutting Angle tip and small graph burning, affecting the cutting quality.

Lead to set

When cutting thick materials, in order to make the cutting joint better and prevent the beginning and end of the burn, usually need to introduce a transition line at the beginning and end of the cutting, and make the lead and tail respectively. The lead and tail are not useful to the workpiece itself, so they should be placed outside the scope of the workpiece, and pay attention to not set the lead in sharp corners and other places that are not easy to heat. Arc transition should be used as far as possible to connect the lead and groove to make the machine run smoothly and avoid burns due to the corner stop.

Public cutting

The cut parts sometimes tip over. If the laser cutting head changes course again, it may cause damage to the cutting head and bring great loss. Therefore, typesetting should pay attention to the reasonable planning of the path, bypass the cutting part, avoid collision; At the same time, choosing the best cutting route can also reduce cutting time and improve work efficiency.

Fiber Laser cutter 06

In the core field, China is in a weak position, many chips need to rely on imports, long-term under the control of others, lack of independent intellectual property rights and upstream and downstream industry chain. During the sino-US trade war in recent years, the US imposed sanctions on China over the chip issue, which made us realize the importance of chips. After the domestic chip manufacturing difficulties of the relevant technology has been overcome.

China has made positive progress in many fields of information industry technology

The breakthrough of information industry technology, with the development of 6G communication technology field, China has stood at the top. China has become a major source of 6G technology patent applications, ranking first in the world.

Soon our country will also have the ability to manufacture high-end chips, I believe that under the continuous accumulation of our innovative technology, the mass production of 7nm chips will soon be realized. It gives hope to technology companies such as mobile phones and cars, which have stalled due to chip problems.

In chip manufacturing, what is the important role of laser cutting machine?

In chip manufacturing, wafer as the core raw material of the chip, laser cutting function is very good to meet the wafer cutting, can effectively avoid the problems existing in grinding wheel scratching

In the core field, China is in a weak position, many chips need to rely on imports, long-term under the control of others, lack of independent intellectual property rights and upstream and downstream industry chain. During the sino-US trade war in recent years, the US imposed sanctions on China over the chip issue, which made us realize the importance of chips. After the domestic chip manufacturing difficulties of the relevant technology has been overcome.

China has made positive progress in many fields of information industry technology

Fiber Laser cutter 09

The breakthrough of information industry technology, with the development of 6G communication technology field, China has stood at the top. China has become a major source of 6G technology patent applications, ranking first in the world.

Soon our country will also have the ability to manufacture high-end chips, I believe that under the continuous accumulation of our innovative technology, the mass production of 7nm chips will soon be realized. It gives hope to technology companies such as mobile phones and cars, which have stalled due to chip problems.

In chip manufacturing, what is the important role of laser cutting machine?

In chip manufacturing, wafer as the core raw material of the chip, laser cutting function is very good to meet the wafer cutting, can effectively avoid the problems existing in grinding wheel scratching

laser 02

1, non-contact processing: laser processing only laser beam and workpiece contact, no cutting force for cutting parts, to avoid damage to the surface of processed materials.

2, high processing accuracy, small thermal impact: pulse laser can do instantaneous high power, high energy density and the average power is very low, can instantly complete processing and the heat affected area is very small, to ensure high precision processing, small heat affected area.

3, high processing efficiency, good economic benefit: laser processing efficiency is often several times the effect of mechanical processing and no pollution-free supplies. The stealth laser cutting technology of semiconductor wafer is a new laser cutting technology, which has many advantages, such as fast cutting speed, no dust, no substrate loss, small cutting channel, complete drying process and so on.

The main principle of laser cutting is to focus the short pulse laser beam through the surface of the material in the middle of the material, forming a calcium layer in the middle of the material, and then through the external pressure to separate the chip.


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